Faculty
Location:Faculty&Staff > Faculty
GONG Jianghong

School of Materials Science and Engineering
Tsinghua University
Beijing 100084
P.R. China
Tel: 86-10-62772855
Fax: 86-10-62771160
E-mail: gong@tsinghua.edu.cn

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Education Background

B.Sc. (Materials Science) Tsinghua University, China (1987)
M.Sc. (Materials Science) Tsinghua University, China (1989)
Ph.D. (Materials Science) Tsinghua University, China (1993)

Work Resume

1993.07 ~ 1995.11 Lecturer, Department of Materials Science and Engineering, Tianjin University, China
1995.12 ~ 1996.12 Associate Professor, Department of Materials Science and Engineering, Tianjin University, China
1997.01 ~ 1997.09 Associate Professor, Department of Physics, Beijing Normal University, China
1997.10 ~ 1998.09 Postdoctoral research fellow, Ecole des Mines de Nancy, France
1999.07 ~ Associate Professor, School of Materials Science and Engineering, Tsinghua University, China

Research Field

1. Mechanical Characterization of Brittle Materials
Indentation deformation and indentation fracture
Strength and its statistical properties
Fracture toughness determination
High-temperature fatigue and creep
Toughening and R-curve behavior
Nanoindentation of brittle materials

2. Electrical Properties of Brittle Materials
Zirconia-based solid electrolytes: compositions, microstructures and properties
Ionic-conducting glasses: processing and properties

Academic Achievements

Up to now, more than 100 papers and 5 books have been published. Click here to see the complete list of the publications.
Some selected papers are listed below (click the title of the paper to see the full text).

1. Jianghong Gong, Zhijian Peng and Hezhuo Miao, “Analysis of the nanoindentation load-displacement curves measured on high-purity fine-grained alumina,” Journal of the European Ceramic Society, 25 (2005) [5] 649- 654
2. Jianghong Gong, Hezhuo Miao and Zhijian Peng, “Analysis of the nanoindentation data measured with a Berkovich indenter for brittle materials: effect of the residual contact stress,” Acta Materialia, 52 (2004) [3] 785-793
3. Jianghong Gong, Hezhuo Miao, Zhijian Peng and Longhao Qi, “Effect of peak load on the determination of hardness and Young’s modulus of hot-pressed Si3N4 by nanoindentation,” Materials Science and Engineering, A354 (2003) [1-2] 140-145
4. Jianghong Gong and Zhenduo Guan, “Strength characteristics of toughened ceramics containing contact-induced small surface cracks,” Materials Science and Engineering, A344 (2003) [1-2] 132-139
5. Jianghong Gong, Ying Li, Zilong Tang, Yusheng Xie and Zhongtai Zhang, “Temperature-dependence of the lattice conductivity of mixed calcia/yttria stabilized zirconia,” Materials Chemistry and Physics, 76 (2002) [2] 212-216
6. Jianghong Gong, Junqiu Wang and Zhenduo Guan, “Indentation toughness of ceramics: a modified approach,” Journal of Materials Science, 37 (2002) [4] 865-869
7. Jianghong Gong, Yufeng Chen and Chunyan Li, “Statistical analysis of fracture toughness of soda-lime glass determined by indentation,” Journal of Non-Crystalline Solids, 279 (2001) [2-3] 219-223
8. Jianghong Gong and Chunsheng Du, “Environmental effects on the room-temperature static fatigue behavior of polycrystalline mullite,” Materials Science and Engineering, A283 (2000) [1-2] 76-81
9. Jianghong Gong, Ying Li, Zhongtai Zhang and Zilong Tang, “AC impedance study of zirconia doped with yttria and calcia,” Journal of the American Ceramic Society, 83 (2000) [3] 648-650
10. Jianghong Gong, Jianjun Wu and Zhenduo Guan, “Examination of the indentation size effect in low-load Vickers hardness testing of ceramics,” Journal of the European Ceramic Society, 19 (1999) [15] 2625-2631
11. Jianghong Gong and Ying Li, “Relationship between the estimated Weibull modulus and the coefficient of variation of the measured strengths for ceramics,” Journal of the American Ceramic Society, 82 (1999) [2] 449-452
12. Jianghong Gong and Zhenduo Guan, “Strength/crack size relationship for Knoop indented bending specimens and its application to silicon nitride ceramic,” Journal of the European Ceramic Society, 18 (1998) [7] 891-899

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